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Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)
Materials 교신저자 20250416 -
Low-temperature instantaneous large-area laser soldering of Al/Cu flexible printed circuit board lap joints with exceptional fracture energy absorption capability: Toward carbon-neutral energy reduction assembly
MATERIALS CHARACTERIZATION 참여저자 20250301 -
Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding
Materials 교신저자 20240722 -
Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations
Journal of Materials Research and Technology-JMR&T 참여저자 20240514 -
Thermo‑Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish
Materials 교신저자 20230220