KITECH

• Enhancement of dielectric performance of encapsulation in barium titanate oxide using size-controlled reduced graphene oxide

  RSC ADVANCES 참여저자 20220601

• Microstructure and mechanical properties of Ag nanoparticles-modified Sn-58Bi/Cu solder joints during liquid-state reaction

  JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 참여저자 20211201

• 다양한 레이저 접합 공정 조건에 따른 Sn-57Bi-1Ag 솔더 접합부의 계면 및 기계적 특성

  마이크로전자 및 패키징학회지(JORNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY) 참여저자 20210630

• Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer

  JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 참여저자 20210101

• 무전해 니켈 도금액 pH 변화에 따른 ENIG/Sn-Ag-Cu솔더 접합부의 취성파괴 특성

  마이크로전자 및 패키징학회지(JORNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY) 교신저자 20200902