연구자 소개
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Effect of (Ni, Au)(3)Sn-4 growth on the thermal resistance of Au-20 wt% Sn solder/ENIG joint in flip-chip LED packages
JAPANESE JOURNAL OF APPLIED PHYSICS 참여저자 20200701 -
Improved sinterability of micro-scale copper paste with a reducing agent
MATERIALS LETTERS 교신저자 20200615 -
Epoxy/silane pre‑synthesis improving thermal properties and adhesion strength of silica‑filled non‑conductive adhesive for fine‑pitch thermocompression bonding
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 참여저자 20200415