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Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints
JOURNAL OF ELECTRONIC MATERIALS 교신저자 20221201 -
Electroless Nickel Autocatalytic Gold (ENAG) 표면처리와 Sn-Ag-Cu 솔더 간 접합부의 계면반응 및 취성파괴 신뢰성 비교 연구
마이크로전자 및 패키징학회지(JORNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY) 교신저자 20220930 -
Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad
MICROELECTRONICS RELIABILITY 참여저자 20220201 -
Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater
대한용접접합학회지(JOURNAL OF WELDING AND JOINING) 교신저자 20210827 -
Effects of CO2 laser pretreatment conditions on adhesion properties of Cu/Ti films and polyimide substrates
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 교신저자 20210601