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다양한 레이저 접합 공정 조건에 따른 Sn-57Bi-1Ag 솔더 접합부의 계면 및 기계적 특성
마이크로전자 및 패키징학회지(JORNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY) 교신저자 20210630 -
Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 교신저자 20210201 -
Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate
METALS 참여저자 20210125 -
Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
MATERIALS 교신저자 20210111 -
Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 참여저자 20210101