KITECH

• Correlation between structured surface pad design and material removal rate in Chemical Mechanical Polishing

  Journal of Manufacturing Processes 참여저자 20251226

• Particle removal behavior of micropatterned pad buffing in post-CMP cleaning

  MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 참여저자 20250801

• 패키지 재배선층 CMP에서 입자가 연마 특성에 미치는 영향

  한국산업융합학회논문집 교신저자 20241231

• (001) 산화갈륨의 와이어쏘 공정 설계 최적화를 위한 기계적 특성 평가

  한국산업융합학회논문집 제1저자 20241231

• Effect of Structures with Structured Surface Pad on Material Removal Rate in Chemical Mechanical Polishing

  ECS Journal of Solid State Science and Technology 참여저자 20240821