KITECH

• Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

  APPLIED SCIENCES-BASEL 참여저자 20210511

• Material Removal Model for Lapping Process Based on Spiral Groove Density

  APPLIED SCIENCES-BASEL 참여저자 20210427

• 고온 롤 라미네이터용 멤브레인 구조 필름형 압력 센서 개발

  한국산업융합학회논문집(JOURNAL OF THE KOREAN SOCIETY OF INDUSTRY CONVERGENCE) 제1저자 20201231

• CMP 패드 두께 프로파일 측정 장치 및 방법에 관한 연구

  한국산업융합학회논문집(JOURNAL OF THE KOREAN SOCIETY OF INDUSTRY CONVERGENCE) 참여저자 20201231

• Effect of the Lapping Platen Groove Density on the Characteristics of Microabrasive-Based Lapping

  MICROMACHINES 참여저자 20200814