KITECH

• Battery Module Bonding Technology for Electric Vehicles

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• Thermal reliability of Cu sintering joints for high-temperature die attach

  MICROELECTRONICS RELIABILITY 참여저자 20230801

• Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach

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• 바이모달 구리 페이스트를 활용한 소결 접합부의 시효 파괴 거동 연구

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• Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints

  JOURNAL OF ELECTRONIC MATERIALS 제2저자 20221201