KITECH

• Effect of Cu/Fe addition on the microstructures and electrical performances of Ni–Co–Mn oxides

  JOURNAL OF ALLOYS AND COMPOUNDS 참여저자 20210405

• Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

  METALS 참여저자 20210125

• Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

  MATERIALS 제2저자 20210111

• 삽입금속 표면 Ar 플라즈마 처리가 전력모듈을 위한 TLP 접합부 특성에 미치는 영향

  대한용접접합학회지(JOURNAL OF WELDING AND JOINING) 참여저자 20200831

• 다중 리플로우에 따른 Sn-Cu-(X)Al-(Y)Si/Cu 접합부 특성 연구

  대한용접접합학회지(JOURNAL OF WELDING AND JOINING) 제1저자 20200420