KITECH

• Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation

  Scientific Reports 교신저자 20230901

• Battery Module Bonding Technology for Electric Vehicles

  마이크로전자 및 패키징학회지 참여저자 20230818

• Power cycling tests under driving ΔTj = 125 ℃ on the Cu clip bonded EV power module

  MICROELECTRONICS RELIABILITY 참여저자 20221101

• Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature

  JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 참여저자 20220901

• 플렉서블 기판의 레이저 투과 용접 및 기계적 특성 평가

  마이크로전자 및 패키징학회지(JORNAL OF THE MICROELECTRONICS AND PACKAGING SOCIETY) 교신저자 20220720