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MLCB 전자부품 접합 공정 기술 개발
대한용접접합학회지 참여저자 20250409 -
Oxidation-free cold copper sinter joining in air using corrosion blocking process
APPLIED SURFACE SCIENCE 교신저자 20250401 -
Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
MICROELECTRONICS RELIABILITY 교신저자 20250401 -
Low-temperature instantaneous large-area laser soldering of Al/Cu flexible printed circuit board lap joints with exceptional fracture energy absorption capability: Toward carbon-neutral energy reduction assembly
MATERIALS CHARACTERIZATION 교신저자 20250301 -
Oxidation-free silver porous sheet bonding onto a bare copper substrate in air
MATERIALS LETTERS 교신저자 20250131