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 Çѱ¹»ý»ê±â¼ú¿¬±¸¿ø¿¡¼­´Â Áö½Ä°æÁ¦ºÎ GlobalTech »ç¾÷ÀÇ ÀÏȯÀ¸·Î ¹Ì±¹¿¡¼­ ÀμâÀüÀÚ(Printed Electronics) ¹× ÀüÀÚÆÐŰ¡(Electronics Packaging)ºÐ¾ß¿¡¼­ ¿À·£ ±â°£ Á¾»çÇϽŠÀç¹ÌÇÑÀΰúÇбâ¼úÀÚ¸¦ ¸ð½Ã°í Ãֽбâ¼ú ¼Ò°³¿Í ÇÔ²² ÇÑ-¹Ì°£ ±â¼úÇù·Â(±â¼úÀÌÀü, °øµ¿»ç¾÷ ¹× °øµ¿¿¬±¸ µî)À» ÃßÁøÇÒ ¼ö ÀÖ´Â ±âȸ¸¦ ¸¶·ÃÇϰíÀÚ ÇÕ´Ï´Ù.


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  ¹Ì±¹ ÷´Ü±â¼ú Àü¹®°¡ ¸í´Ü ¹× ±â¼ú°³¿ä

 

 

¼º¸í

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Á¦¾È±â¼ú

±è ÇÑÁØ

Han-Jun Kim

HP Labs & Phicot Inc

ÀÚ°¡Á¤·Ä ¹æ½Ä ÀÓÇÁ¸°Æ® ¸®¼Ò±×·¡ÇÇ(Self-Aligned Imprint Lithography SAIL)¿¡ ÀÇÇÑ Ç÷º½Ãºí µð½ºÇ÷¹ÀÌ ¹éÇ÷¹ÀÎÀÇ ·ÑÅõ·Ñ(Roll-to-Roll) »ý»ê

ÀÌ ¼º

Sung Yi

Associate Professor

Mechanical and Materials Engineering Department

Portland State University

¸¶ÀÌÅ©·Î¿þÀ̺긦 ÀÌ¿ëÇÑ ÀÏ·ºÆ®·Î´Ð½º ¾ÖÇø®ÄÉÀÌ¼Ç °íºÐÀÚ Àç·áÀÇ ¿­È¿À²ÀûÀÎ °æÈ­¹æ¹ý

¹Ú Èñ±Ç

Hee K. Park

Vice President

AppliFlex LLC

¿¬¼º ÀüÀÚ±â±â Á¦Á¶ (flexible electronics manufacturing)¸¦ À§ÇÑ ±Ý¼Ó»êÈ­¹° ³ª³ë¼ÒÀç(metal oxide nanomaterials)¿Í ·¹ÀÌÀú °¡°ø(laser processing)ÀÇ °áÇÕ

±è ³²¼ö

Nam-Soo Kim

Associate Professor, Department of Metallurgical and Materials Engineering

University of Texas

at El Paso

 UTEP º¸À¯ ÇÁ¸°ÆÃ°øÁ¤ ¹× Àç·á°³¹ß

ÀÌ ±Ô¿À

Kyu-Oh Lee

Assembly and Test Technology Development

Intel Corporation

°í¹Ðµµ ¸¶ÀÌÅ©·ÎÇÁ·Î¼¼¼­ ÆÐŰ¡ Àç·á

ÇÑ Áø¿ì

Jin-Woo Han

 NASA Ames Research Center

Áø°øÆÐŰÁö¸¦ ÀÌ¿ëÇÑ ³ª³ë Áø°ø°ü °øÁ¤ ±â¼ú

¹® °æ½Ä

Kyoung-Sik Moon

School of Materials Science & Engineering

Georgia Institute of Technology

¸¶ÀÌÅ©·Î ÀüÀÚ ÆÐŰ¡¿ë Àç·á

À± Á¾±¤

Chong K. Yoon

Executive Partner,

BT Sense

½º¸¶Æ® À̵¿Åë½Å ´Ü¸»±â ¹× ´ë¿ë·® ¸¶ÀÌÅ©·Î ÇÁ·Î¼¼¼­ÀÇ 2D ¹× 3D ½Ã½ºÅÛ ÆÐŰ¡À» À§ÇÑ ÃʼÒÇü ¸¶ÀÌÅ©·Î ¹× ³ª³ë±Þ Interconnection ±â¼ú

 

 * ÷ºÎ : Á¦¾È±â¼ú °³¿ä

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