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Correlation between structured surface pad design and material removal rate in Chemical Mechanical Polishing
Journal of Manufacturing Processes 교신저자 20251226 -
Particle removal behavior of micropatterned pad buffing in post-CMP cleaning
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 교신저자 20250801 -
Effect of Structures with Structured Surface Pad on Material Removal Rate in Chemical Mechanical Polishing
ECS Journal of Solid State Science and Technology 교신저자 20240821 -
Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad
APPLIED SCIENCES-BASEL 교신저자 20210511 -
Material Removal Model for Lapping Process Based on Spiral Groove Density
APPLIED SCIENCES-BASEL 교신저자 20210427