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Finite Element Analysis and Reliability Evaluation of Thermal Shock Behavior in Ag Sintered Joints with Varying Bond-Line Thicknesses
대한용접접합학회지 교신저자 20251125 -
Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?
MICROELECTRONICS RELIABILITY 교신저자 20250401 -
Controlling the solidification speed toward enhanced failure energy of Sn-0.7Cu system solder ball-attaches with alloy design using instantaneous large-area laser soldering
MATERIALS CHARACTERIZATION 교신저자 20250103 -
Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 참여저자 20240207 -
Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation
Scientific Reports 참여저자 20230901