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Stress-Induced α′′ Martensitic Transformation Mechanism in Deformation Twinning of Metastable β-Type Ti-27Nb-0.5Ge Alloy under Tension
MATERIALS TRANSACTIONS 참여저자 20161101 -
Tensile Properties of Copper–Nickel Fine Clad Prepared by Surface Activation Bonding and Subsequent Heat Treatment
ELECTRONIC MATERIALS LETTERS 참여저자 20131110 -
The Influence of Surface-Activated Bonding Treatment on the Peel Strength of Cu–Ni Metal Clad
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY 제1저자 20130428 -
Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surfeac Activated Bonding
Materials Transactions 2010 -
Development and evaluation of a Cu composite sheet with embedded high
Current Applied Physics 2010