KITECH

• Laser machining process monitoring using stethoscope and neural networks

  Journal of Manufacturing Processes 참여저자 20251212

• A Review of Through-Silicon Via Inspection and Metrology Technology for Advanced Semiconductor Packaging

  JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME 교신저자 20251201

• Improving fatigue life and toughness in electron beam welded Ti-6Al-4V achieved through beta heat treatment for microstructure uniformity

  Journal of Materials Research and Technology-JMR&T 교신저자 20250301

• Silicon-via (Si-via) hole metrology and inspection by grayfield edge diffractometry

  Journal of Manufacturing Processes 참여저자 20250117

• 펨토초 레이저의 싱글 모드 및 버스트 모드에 따른 Through Glass Via 가공 형상 및 기계적 특성에 대한 비교 분석

  마이크로전자 및 패키징학회지 교신저자 20241231