KITECH

• Synergistic effect of CTA+ and Br- on defect-free TSV filling by Cu electrodeposition

  ELECTROCHIMICA ACTA 참여저자 20241101

• Reduction Kinetics of Gold Nanoparticles Synthesis via Plasma Discharge in Water

  한국표면공학회지 제2저자 20231228

• Effect of ZnO Nanoparticle Presence on SCC Mitigation in Alloy 600 in a Simulated Pressurized Water Reactors Environment

  한국표면공학회지 참여저자 20231219

• On the role of complexing agents in co-electrodeposition of SnAg alloy with uniform composition

  MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 참여저자 20231101

• Unraveling Adsorption Behaviors of Levelers for Bottom-Up Copper Filling in Through-Silicon-Via

  ELECTRONIC MATERIALS LETTERS 참여저자 20221101