KITECH

• Correlation between structured surface pad design and material removal rate in Chemical Mechanical Polishing

  Journal of Manufacturing Processes 참여저자 20251226

• Particle removal behavior of micropatterned pad buffing in post-CMP cleaning

  MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 참여저자 20250801

• 패키지 재배선층 CMP에서 입자가 연마 특성에 미치는 영향

  한국산업융합학회논문집 제1저자 20241231

• Effect of Structures with Structured Surface Pad on Material Removal Rate in Chemical Mechanical Polishing

  ECS Journal of Solid State Science and Technology 참여저자 20240821

• Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

  APPLIED SCIENCES-BASEL 제2저자 20210511