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A Study on Optimization of Substrate-pad designs and Process Conditions for Mounting of MLCB Electronic Compononets
마이크로전자 및 패키징학회지 참여저자 20251229 -
Lowest sinterable temperature Ag nanoporous sheet bonding at 145–175 °C on Ag-plated Cu and interfacial microstructural degradation under 250 °C aging: Correlation with strength and fracture energy
Journal of Materials Research and Technology-JMR&T 교신저자 20251101 -
Novel solid-state bonding for direct cooling of power inverter parts based on partially phase transition and diffusion intermetallic controlling: Experimental, FEM and CFD, material thermodynamic calculation investigation
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER 교신저자 20250901 -
Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability
Ceramics International 참여저자 20250531 -
Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates
MICROELECTRONICS RELIABILITY 교신저자 20250501